Bakelite paper is introduced

Bakelite Paper (Impr? Egnating Insulation Paper) as Paper base copper clad main reinforced material, commonly there are two types: dip bleached cotton fiber Paper (in cotton linter as raw materials) and dipping bleaching wood fiber Paper (and divided into hardwood pulp is given priority to). At present, the latter is more widely used.
Impregnated paper production process is commonly: cooking washed pulp and mixing a beating a purify a screening a processing program. Made of special copper-clad plate, the main performance indicators are: paper quantitative (general use 126 g/m. Or 135 g/m). , density (density), water absorption (in suction height said, general requirements higher than 85 mm / 10 min), tensile strength, ash content, moisture, wet strength, hue, and vertical and horizontal to tensile ratio, wide quantitative tolerance, etc.
Paper quantitative uniformity, to ensure that the thickness of the plate, dimensional stability, resistance to peel strength and glue manufacturability is very important. Paper density, water absorption (water level), glue for semi-finished products of resin penetration, plate flatness, dimensional stability, dielectric properties, punching resistance, such as water has a great influence. Paper tensile strength on the plate of the mechanical strength height and punching workability is good or bad influence. Paper fight b: mr.zhang qiang through low, can not guarantee semi-finished glue smoothly. Paper tensile strength aspect difference, should guarantee the small (less than 1.5) can well ensure plate flatness, otherwise, it will lead to the distortion of the board or warping.
The ash content of the paper, and the board of blunt this L property and electrical property there is a link. Paper the impurities, add fertilizer ingredients and add quantity and pulp pH value control, all on board of the dielectric properties, resistance to dip soldering sex has different effects. The appearance of the paper quality problem, the main cause sizing process control difficulties caused by the appearance of the plate, and problems.